Semiconductor fabrication Dry Etch processing solution

Dry Etch processing challenges

Dry etching can also be known as plasma etching and it is the process of removing a pattern of semiconductor material from the wafer by masking out areas on the surface and radiating the exposed surface with ions. It is done with ions rather than with chemical treatment. The ions are typically, reactive gases such as oxygen, boron, fluorocarbons. Through multiple etching stages a masking substance is used to resist etching and thereby protect a part of the wafer.