Semiconductor fabrication Dry Etch processing solution

Fast response to process disturbances is critical for Semiconductor Dry Etch short processing times

Dry Etch processing challenges

Dry etching can also be known as plasma etching and it is the process of removing a pattern of semiconductor material from the wafer by masking out areas on the surface and radiating the exposed surface with ions. It is done with ions rather than with chemical treatment. The ions are typically, reactive gases such as oxygen, boron, fluorocarbons. Through multiple etching stages a masking substance is used to resist etching and thereby protect a part of the wafer.

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Complex recipes and short processing times require:

Eurotherm precision temperature and power control

Fast response to process disturbances

Cascade control offers fast response to process disturbances which helps maximize production throughput

Substrate temperature is critical to the process recipe

Precise, uniform substrate temperature control

Often high temperature processing

EPack power feedback (V2) helps minimize energy use

Constant demand for smaller wafers and smaller machines

Reduced footprint using compact products and flexible control solutions

Dry Etch processing with Eurotherm control solution

During the process, gas entry causes temperature disturbances. Eurotherm offers accurate temperature measurement, precise heater control and fast response to temperature disturbances.

With Eurotherm support, customers can manage ±1°C precision temperature control during the Helium cooling process stage, and ±0.5°C for other stages.